At AMD Keynote’s Computex 2022 conference, CEO Dr. Lisa Su
officially unveiled the next generation of Ryzen processors and the successor to the hugely successful Ryzen 5000 series. The new family, the Ryzen 7000 series, will feature up to 16 Zen 4 cores using the optimized 5-nm technological process TSMC.
The AMD Ryzen 7000 also officially marks the end of the long-running AM4 socket. The new AM5 LGA1718 socket will replace it with the just-announced trio of new performance-oriented chipsets such as the X670E, X670, and B650.
AMD has not yet detailed the Zen 4 architecture, but it is known that it will receive 1 MB of L2 cache memory per core, which is twice as much L2 cache than Zen 3 (and Zen 2) cores. However, AMD does not give details about its L3 cache or whether we will see the Zen 4 models with 3D V-cache.
Combined with improved L2 cache, AMD aims to increase clock speed through its architectural design and 5-nm TSMC process. Officially, the company now claims only a maximum clock speed of 5+ GHz, but in a demonstration video shown by Dr. Su, it was shown that the 16-core AMD Ryzen 7000 chip has a frequency above 5.5 GHz. As a result of improved cache, architecture, and higher clock speeds, AMD is advertising increased productivity in single-threaded tasks by more than 15%.
For the Ryzen 7000, AMD has also created a new 6 nm I/O die (IOD) that will replace the 14 nm IOD used in previous Zen 3. The new IOD includes an iGPU, in this case based on the RDNA2 architecture. So, with the Ryzen 7000 generation, all AMD processors will technically also be a hybrid of processor and graphics Accelerated Processing Unit (APU), as graphics are a major part of the chip’s design. That is, the new AMD processors will be suitable for use in systems without discrete graphics, which, although not a big problem for consumers, will be an advantage for corporate / commercial systems.
In terms of power, it is also worth noting that AMD indicates that the Ryzen 7000 will work with a higher thermal package (TDP). The company notes that the new AM5 platform allows the use of TDP up to 170 watts in this generation, which is more than Ryzen’s 105 watts TDP based on AM4 for the 5000 series.
And last but not least, the AMD Zen 4 microarchitecture combined with the new IOD also provides a lot of new features, including official PCIe 5.0 support. The combination of AMD Ryzen 7000 with X670E, X670 or B650 motherboard will provide up to 24 PCIe 5.0 bands divided between slots and storage devices, with support for up to 14 USB ports, the latest 6E wireless Wi-Fi networks, and the ability to connect up to four displays via HDMI 2.1 and DisplayPort 2.