Intel reports that progress in the development of the 20A process has enabled the company to skip this stage and move directly to the 18A process (1.8-nm). Arrow Lake processors that will use the 20A process will be manufactured at Intel’s partner fabs.
The letter A in the process name stands for the unit of measurement of the process – angstrom, which corresponds to 0.1 nanometer.
The success of the 20A development allowed the company to successfully integrate the RibbonFET gate transistor architecture and PowerVia power technology. Intel’s Vice President Ben Sell explains that this solution will allow the company not to waste engineering resources and immediately produce the best product the company can.
The current defect density of Intel 18A is already D0 < 0.40, which is why the company considers it economically feasible to upgrade to the new version now.
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