Samsung has started mass production of the world’s thinnest 4-layer LPDDR5X memory modules with a capacity of 12 and 16 GB. They are about 0.65 mm thick, which is 0.06 mm thinner than conventional LPDDR5X modules. This was reported by Tom’s Hardware.
Samsung applied a new packaging technology using an optimized printed circuit board (PCB) and epoxy molding compound (EMC) to produce new cases with a 4-level structure.
An optimized overlay process was used to further reduce the module thickness. This will increase the free space inside the smartphone, which will contribute to better airflow for cooling.
Samsung said that the new 0.65mm LPDDR5X packages are 9% thinner than the previous generation and improve thermal stability by 21.2%.
This could lead to even thinner smartphones from many manufacturers, or higher performance levels due to better cooling.
In the future, Samsung plans to expand the range of LPDDR5X variations. The company intends to develop 6-layer 24GB and 8-layer 36GB modules in compact packages. Samsung has not yet announced the thickness of these modules.
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