MSI B850 GAMING PLUS WIFI6E: a board without overpayments

When choosing a motherboard for a new system, a rational approach often works. Judging by the popularity of models with a balanced set of characteristics at a moderate price, many users do not go to extremes, preferring mid-range devices with a sufficient set of options. After all, top-end boards undoubtedly impress with their equipment and capabilities, but their cost does not scare away except true enthusiasts. In contrast, basic ones offer very limited functionality and often raise the question: "how does it even work?". So today we have a board from the category of optimal solutions for review – MSI B850 GAMING PLUS WIFI6E based on the AMD B850 chipset for the Socket AM5 platform.

Package contents

The board is offered in a medium-sized cardboard box with a combined design and a clearly visible model name on the top panel.

The MSI B850 GAMING PLUS WIFI6E comes with a quick assembly guide, one SATA cable, a 1 to 2 EZ Conn-Cable (V1) adapter, an external antenna for the Wi-Fi module, an EZ M.2 Clip II Remover for installing screwless M.2 storage racks, and a set of branded stickers with logos and markings.

Design and layout

MSI B850 GAMING PLUS WIFI6E based on the AMD B850 chipset complies with the ATX standard with classic dimensions of 305x244 mm. The board is designed to work with any processors for the AM5 platform. Recall that the current range of such chips includes models of the Ryzen 9000/8000/7000 series. Socket AM5 will probably also be used for the next generation CPU with the Zen 6 architecture, so there are still considerable prospects here.

The model uses a 6-layer printed circuit board with increased thickness of copper conductors (2oz Copper) – a typical choice in this class. As for the overall external design, the MSI B850 GAMING PLUS WIFI6E is on the "light side of strength" – we have a white PCB, silver radiators and black functional/power connectors. The largest aluminum block of the cooling system is decorated with the profile of the invariable gaming logo of the MSI gaming product series - the silhouette of a dragon. We should also note additional patterns on the radiators and PCB, forming a certain visual diagonal between the upper left and lower right corners.

MSI B850 GAMING PLUS WIFI6E received a 15-phase (12+2+1) configuration of the processor power stabilization subsystem using doubling of DRPS/P-PAK cascades. Additional coolers are provided for cooling the VRM power elements, as well as chokes. One of the blocks covering the keys along the interface panel has significantly increased dimensions. This is a proprietary MSI development, which has already become a characteristic feature of mid-level motherboards and above. Visually, the aluminum radiators this time have a fairly simple profile shape. To improve contact with the elements, thermoplastic stickers with a thermal conductivity of 7 W/mK are used.

Two 8-pin EPS12V connectors are provided to connect additional CPU power.

The board has four slots for DDR5 memory modules. The model can work with strips with a capacity of up to 64 GB, and therefore the total RAM capacity can be up to 256 GB. As for speed indicators, support for kits up to DDR5-8200+ when using Ryzen 9000 chips is declared. Checking the validated kits listed on the manufacturer's website, we see a large list of tested kits, which is currently limited to DDR5-8000. In general, this is too much for the optimal mode of the memory subsystem, but more is not less.

It is expected that the use of speed modes depends on the configuration of the modules. Namely, the maximum performance is available when using a pair of peer-to-peer strips. However, even four dual-rank modules of maximum capacity will operate in DDR5-6000 mode.

DIMM slots have a one-sided locking mechanism, which usually simplifies the procedure for uninstalling modules when the system is already assembled in the case and it is not very convenient to reach the fasteners.

Let's evaluate the general layout of the board. So, MSI B850 GAMING PLUS WIFI6E received three slots for additional expansion cards. We have a full-size PCI-E x16, which complies with the PCI-E 4.0 specification and always works in full speed mode (x16). Of course, if we are talking about situations using Ryzen 7000/9000 processors. Ryzen 8700/ 8600/8400 series chips will limit the mode to PCI-E 4.0 x8, and Ryzen 8500/8300 will leave only PCI-E 4.0 x4. This is one of the reasons why the latest CPUs should not be considered as possible options for even entry-level gaming systems.

Since we have a direct dependence on the chip, it is obvious that the processor lines of the PCI Express bus are used for the slot.

The PCI_E1 connector itself has a metal casing for mechanical reinforcement of the connector. Another feature of the slot is a significant increase in the blade of the retainer (EZ PCIe Clip II). Despite the fact that this is not some technological know-how, even such a solution will simplify the removal of the video card.

The board also has a compact PCI-E 3.0 x1 slot. A channel with such capabilities can be used for expansion cards that do not require high bus bandwidth (up to 1 GB/s). For example, sound cards or network controllers. We will immediately note the significant distance between PCI_E1 and PCI_E2. The compact slot will remain available even when using video cards with cooling systems that occupy more than three expansion slots. And these are not only flagship models. For example, RTX 5070-level adapters can already be made in the "3+" design.

The third available slot has a full-size format and PCI-E 4.0 x4 configuration. Like the compact connector, it is serviced by the chipset and does not share bus resources with any other port. So, regardless of the configuration, we always have a stable PCI-E 4.0 x4 port with a bandwidth of up to 8 GB/s. This can be used, for example, to connect an additional M.2 with the appropriate adapter.

And what are the standard storage options for configuring the MSI B850 GAMING PLUS WIFI6E? The board offers two ports for M.2 drives, and this is probably the minimum set for a full-size ATX model of this class.

The first M.2_1 port supports PCI-E 5.0 x4 mode, allowing you to use the fastest SSDs. Although it is worth recalling that transfers of up to 16 GB/s will be possible if the system is equipped with Ryzen 7000/9000 processors. Additional cooling is also provided for M.2_1. The aluminum profile of moderate dimensions provides for screw fastening.

The second port (M.2_2) is located next to the PCI-E x1 slot, it uses the capabilities of the chipset and offers PCI-E 4.0 x4 mode.

In both cases, the SSD has a screwless mounting system. The drives are secured using metal fasteners.

The M.2_1 port allows you to use drives of the 2280 format and the larger 22110 format. While the M.2_2 is designed for 2280/2260. In both cases, we are talking exclusively about SSDs with the PCI Express interface. If necessary, the board allows you to organize RAID 0 and 1 arrays formed from M.2 NVMe.

As for the ability to use drives and other devices with a SATA interface, the MSI B850 GAMING PLUS WIFI6E is equipped with four SATA 6 Gb/s for this. This is the number of ports that AMD B850 allows to implement without the help of external controllers. The connectors are positioned parallel to the plane of the printed circuit board, which allows you to connect interface cables even in the case when the group of SATA ports is covered by a video card with a massive cooler.

The AMD B850 chipset (Promontory 21) chip has received a rather large additional cooler with a non-trivial profile configuration, which increases the dissipation area. At the same time, technological ribbing is provided for the inner surface of the block so as not to accumulate dust in a hard-to-clean place, or at least not to attract attention.

MSI B850 GAMING PLUS WIFI6E offers decent options for setting up a cooling system. The board has six 4-pin connectors for connecting fans. In addition, the CPU cooler connector can provide power up to 24 W (12 V, 2 A), while the connector for connecting a liquid cooling pump is reinforced up to 36 W (12 V, 3 A).

Separate channels for case fans have standard ratings – 12V, 1A (W). All connectors have the ability to automatically detect the speed control method (PWM/DC).

In addition to classic connectors, the board is also equipped with a proprietary EZ Con connector, which simplifies the process of connecting fans with ARGB lighting.

The board is expectedly equipped with the EZ Debug LED primary self-diagnostic system with a set of LEDs that signal if problems are detected with a specific node (processor, memory, video card, storage).

What about decorative lighting? In the basic version, the MSI B850 GAMING PLUS WIFI6E is not equipped with additional illumination. Usually, such a technique is now used only pointwise and in the case of higher-level boards. However, the PCB has one connector for connecting RGB strips on 5050 elements and as many as three connectors for addressable ARGB Gen2. If desired, the owner will be able to decorate the platform quite a bit. Of course, Mystic Light technology allows you to synchronize and adjust the backlighting algorithm of all system elements.

MSI B850 GAMING PLUS WIFI6E has an internal USB Type-C connector for outputting the corresponding port to the case panel. In this case, support for USB 3.2 Gen 2 with a bandwidth of up to 10 Gb/s is implemented. It is good that it is not limited to 5 Gb/s (USB 3.2 Gen1), since most external SSDs are capable of providing transfers at the level of 1000 MB/s. However, the fastest ones (2000 MB/s) will already be limited by the capabilities of the interface.

The sound subsystem of the board is implemented on the basis of the already well-known Realtek ALC897 chip. The path is partially isolated on the general PCB array, the circuit uses specialized capacitors. The developers note the use of different PCB layers for the distribution of the right and left channels. You should not expect any special revelations, however, despite some skepticism regarding the choice of codec, the listening results do not disappoint.

The sound has an emphasis on high frequencies: they have good detail, but in some compositions they sound a bit harsh, and in others there is clearly more of them than necessary. The "middle" is a bit dry, I would like to add a little depth to the voices. The bass is not excessive, quite clear and detailed.

By the name of the MSI B850 GAMING PLUS WIFI6E model, it is easy to guess that the board is initially equipped with a controller for working with wireless networks. This time, the specified index even contains the corresponding specification. Indeed, a tri-band (2.4/5/6 GHz) AMD RZ616 module is used here, which supports WiFi 6E (802.11ax) with additional 160 MHz channels. The declared maximum data transfer rate is up to 2.4 Gb/s. The controller also supports Bluetooth 5.3.

For wired network communication, the board is equipped with a Realtek 8125D with a bandwidth of up to 2.5 Gb/s.

MSI B850 GAMING PLUS WIFI6E has a fixed plug for the interface panel, although in this class its absence would rather cause surprise. As for the composition of connectors, it is quite practical. We immediately note three USB 3.2 Gen2 ports (10 Gb/s) and four more USB 3.2 Gen1 (5 Gb/s). A considerable number of classic Type-A will never hurt. We also have one USB Type-C (USB 3.2 Gen2, 10 Gb/s). If the processor is equipped with integrated graphics, you can use DisplayPort 1.4 or HDMI 2.1 to output the image. For both cases, support for modes up to 4K@60 Hz is declared.

We also have a socket for a wired Ethernet network and connectors for connecting the complete external antenna of the WiFi 6E wireless module on the panel. Three 3.5 mm audio jacks are provided for configuring the speaker system. There is no S/PDIF digital output.

We should also note the presence of two additional buttons – Clear CMOS, for clearing CMOS memory settings, and Flash BIOS for activating the mechanism for offline firmware updates from a USB drive.

The back of the PCB has a matte silver finish. There are a minimum of surface mount elements on this side of the PCB. In the VRM area, we note the presence of phase doublers. All heatsinks are screwed.

Test bench configuration

• Motherboard: MSI B850 GAMING PLUS WIFI6E (ATX, AMD B850)
• Processor: Ryzen 7 9700X (8/16; 3.8/5.5 GHz; 32 MB L3)
• CPU cooler: MSI MAG COREFROZR AA13
• RAM: Kingston FURY Renegade DDR5-7200 2×16GB (KF572C38RWK2-32)
• Graphics card: MSI GeForce RTX 4060 GAMING X 8G
• Drive: Kingston KC3000 1 GB (SKC3000S/1024G)

In operation

To test the capabilities of the MSI B850 GAMING PLUS WIFI6E, we used the Ryzen 7 9700X processor.

A well-known 8-core 16-thread processor with its "highlight", namely the ability to transform from a chip with a nominal TDP of 65 W to a CPU with a TDP of 105 W, after which the chip significantly increases performance when performing multi-threaded tasks.

Since the CPU's capabilities are already well studied, we will leave only a small list of screenshots with the results of the Ryzen 7 9700X in popular benchmarks (TDP 105 W).

What interests us first and foremost is the operating modes of the processor and motherboard in different conditions, as well as the temperature/frequency indicators when using an available CPU air cooling system.

The role of the latter in our case was played by a new "tower" – MSI MAG COREFROZR AA13. Four 6-mm tubes, a block of 50 aluminum plates and a 120 mm fan (500–2000 rpm) for 1200 UAH. Well, let's see.

Let's start with the Ryzen 7 9700X's standard mode, when it operates with a specified TDP of 65 W. To create a high load on all computing units, we use the Cinebench R23 benchmark. We record system performance using the HWInfo64 service utility.

In the base mode, the Ryzen 7 9700X (TDP 65 W) managed to get 19,440 points (Multi Core). Under these conditions, the CPU operating frequency under load was kept at 4400 MHz with a supply voltage of 1.0–1.01 V. The chip consumed up to 88 W of energy, heating up to 57–62 ° C at a fan speed of 1400 rpm. For the motherboard, this is a certain "relaxation". The temperature of the VRM elements did not exceed 53 ° C, the chipset – 40.5 ° C.

We increase the load by switching to the "TDP 105 W" mode, changing only one relevant parameter in the board's BIOS. The processor's performance in multi-threaded mode increases significantly. We already record 22,899 points in Cinebench R23 (Multi Core). Where does the "additional boost" come from? Let's analyze the system parameters. So, the CPU operating frequency has increased to 5100–5150 MHz, so it is not surprising that we have such a spurt. At the same time, the supply voltage has also increased to 1.2 V. The maximum power consumption has increased to 140–142 W, while the temperature of the Ryzen 7 9700X has increased to 88–91 C even despite the fan speed increasing to 1900 rpm. The board easily withstands such conditions. The VRM elements heated up to a moderate 61 C, the chipset – 41 C.

AMD offers a Precision Boost Overdrive mechanism for adjusting the processor. A very convenient option that allows you to adjust the CPU operating parameters based on target indicators. On the MSI B850 GAMING PLUS WIFI6E board, this function is implemented in the appropriate section, where you can select "thermal points" at 85C, 75C and 65C. After selecting a specific mode, the platform will automatically adjust additional CPU parameters so that the actual processor heating indicators do not exceed the set values.

This is a very useful option, especially when using a moderately efficient cooling system. In this case, you can get a normal operating temperature even for a powerful CPU. Yes, the processor performance will be reduced to some extent, but this may be a justified measure.

Let's conduct an experiment with the test Ryzen 7 9700X, choosing "benchmark" points at 75C and 65C, leaving the TDP mode of 105 W active. For the load, we use the same test stage – Cinebench R23 in multi-threaded mode.

With the PBO limit set to 75C, we get 22,723 points. The difference in results with the typical TDP mode of 105 W is almost within the statistical error. The processor under load operated at 5000–5050 MHz at 1.12 V. The temperature really stayed at 74–75C. The CPU power consumption under load was about 120 W. At the same time, the VRM on the motherboard heated up to 56C, the chipset to 37C. A similar mode can actually be used immediately instead of the standard one. Without complex settings, we have less CPU/VRM heating with almost unchanged performance.

We go further and set the limit at 65C. The final result in Cinebench R23 is 21,805 points. The difference with the "pure" TDP of 105 W is about 1,000 points or ~5%. In this case, during scene rendering, the processor was accelerated to ~4,800 MHz with a supply voltage of 1.03–1.05 V. The chip actually heated up to only 65.4C, and the average actual power consumption was ~100 W. At the same time, the MSI MAG COREFROZR AA13 fan speed barely exceeded 1,600 rpm. The power elements of the motherboard also "chilled" at 54C, the chipset - 38C.

Once again, we emphasize that PBO profiles are a very user-friendly thing. Trivial settings allow you to choose the best mode, balancing between cooling efficiency and processor performance. Minimal changes here allow you to get excellent results. And all this without first digging through an endless number of options. Simple solutions are not always the best, but the presence of such tools simplifies system optimization even for experienced users. Well, for those who are not ready to spend a lot of time on system settings, this is a gift.

CPU Overclocking

Experiments with overclocking the Ryzen 7 9700X are hampered by the moderate efficiency of the test platform's cooler.

The processor was able to be accelerated to the typical 5400 MHz on all cores, but in this mode the chip temperature already exceeded 100C. The supply voltage was 1.245 V, and the power consumption level was 175 W. The additional 300 MHz certainly improves performance somewhat, but for such conditions a more efficient cooler is desirable. And frankly, in general there is a question about the justification of a significant increase in power consumption/heating of the processor, when it comes to increasing performance by only a few percent. Academic interest is usually satisfied on boards of a different level and with much more expensive coolers.

RAM

During platform testing, we used a DDR5-7200 RAM kit.

Speed kits above DDR5-6000/6400, which require switching to asynchronous mode of operation of memory controllers and Infinity Fabric, do not bring obvious benefits for solutions on the Socket AM5 platform. With aggressive settings of delays, you can slightly improve the overall latency of the memory subsystem, but the impact on the overall system capabilities is minimal. In principle, the board allows the use of such high-speed modules – well, and that's good.

The test kit worked stably in DDR5-8000 mode with a latency formula of 36-46-46-122.