Samsung Electronics is reportedly planning to switch to glass interposers in semiconductor manufacturing starting in 2028. The move is aimed at increasing the performance of AI chips, reducing manufacturing costs, and providing a technological edge over competitors, WccfTech reports, citing ETNews.
Interposers play a key role in 2.5D chip packaging, especially for AI chips where GPUs interface with high-bandwidth memory (HBM). Interposers are responsible for connecting two components, enabling faster communication between them. Traditional silicon interposers are efficient but expensive. Glass interposers, on the other hand, offer higher precision, better dimensional stability, and lower cost.
Samsung is developing glass interposers smaller than 100x100mm, which will allow for faster prototyping and faster time to market. The company is also using PLP technology at its Cheonan campus, which uses square panels instead of round ones.
This transition is part of the AI Integrated Solution strategy, which integrates foundry, HBM memory, and advanced packaging. The new technology is expected to help Samsung strengthen its position in the AI market and attract external orders, contributing to the company's revenue growth.